Structure and formation method of package structure with underfill

ABSTRACT

A structure and a formation method of a package structure are provided. The method includes disposing a semiconductor die structure over a substrate. The method also includes disposing a protective film over the substrate. The protective film has an opening exposing the semiconductor die structure, and sidewalls of the opening surround the semiconductor die structure. The method further includes dispensing an underfill material into the opening to surround the semiconductor die structure.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. Continuing advances in semiconductor manufacturing processeshave resulted in semiconductor devices with finer features and/or higherdegrees of integration. Functional density (i.e., the number ofinterconnected devices per chip area) has generally increased whilefeature size (i.e., the smallest component that can be created using afabrication process) has decreased. This scaling-down process generallyprovides benefits by increasing production efficiency and loweringassociated costs.

A chip package not only provides protection for semiconductor devicesfrom environmental contaminants, but also provides a connectioninterface for the semiconductor devices packaged therein. Smallerpackage structures, which utilize less area or are lower in height, havebeen developed to package the semiconductor devices.

New packaging technologies have been developed to further improve thedensity and functionalities of semiconductor dies. These relatively newtypes of packaging technologies for semiconductor dies facemanufacturing challenges.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A-1D are perspective views of various stages of a process forforming a package structure, in accordance with some embodiments.

FIGS. 2A-2E are cross-sectional views of various stages of a process forforming a package structure, in accordance with some embodiments.

FIG. 3 is a top view of an intermediate stage of a process for forming apackage structure, in accordance with some embodiments.

FIG. 4 is a perspective view of an intermediate stage of a process forforming a package structure, in accordance with some embodiments.

FIGS. 5A-5C are perspective views of various stages of a process forforming a package structure, in accordance with some embodiments.

FIG. 6 is a cross-sectional view of a package structure, in accordancewith some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The term “substantially” in the description, such as in “substantiallyflat” or in “substantially coplanar”, etc., will be understood by theperson skilled in the art. In some embodiments the adjectivesubstantially may be removed. Where applicable, the term “substantially”may also include embodiments with “entirely”, “completely”, “all”, etc.Where applicable, the term “substantially” may also relate to 90% orhigher, such as 95% or higher, especially 99% or higher, including 100%.Furthermore, terms such as “substantially parallel” or “substantiallyperpendicular” are to be interpreted as not to exclude insignificantdeviation from the specified arrangement and may include for exampledeviations of up to 10°. The word “substantially” does not exclude“completely” e.g. a composition which is “substantially free” from Y maybe completely free from Y.

Terms such as “about” in conjunction with a specific distance or sizeare to be interpreted so as not to exclude insignificant deviation fromthe specified distance or size and may include for example deviations ofup to 10%. The term “about” in relation to a numerical value x may meanx±5 or 10%.

Some embodiments of the disclosure are described. Additional operationscan be provided before, during, and/or after the stages described inthese embodiments. Some of the stages that are described can be replacedor eliminated for different embodiments. Additional features can beadded to the semiconductor device structure. Some of the featuresdescribed below can be replaced or eliminated for different embodiments.Although some embodiments are discussed with operations performed in aparticular order, these operations may be performed in another logicalorder.

Embodiments of the disclosure may relate to 3D packaging or 3D-ICdevices. Other features and processes may also be included. For example,testing structures may be included to aid in the verification testing ofthe 3D packaging or 3D-IC devices. The testing structures may include,for example, test pads formed in a redistribution layer or on asubstrate that allows the testing of the 3D packaging or 3D-IC, the useof probes and/or probe cards, and the like. The verification testing maybe performed on intermediate structures as well as the final structure.Additionally, the structures and methods disclosed herein may be used inconjunction with testing methodologies that incorporate intermediateverification of known good dies to increase the yield and decreasecosts.

FIGS. 1A-1D are perspective views of various stages of a process forforming a package structure, in accordance with some embodiments. FIGS.2A-2E are cross-sectional views of various stages of a process forforming a package structure, in accordance with some embodiments. Insome embodiments, FIG. 2A is a cross-sectional view taken along the line2-2 in FIG. 1A.

As shown in FIGS. 1A and 2A, a substrate 100 is received or provided, inaccordance with some embodiments. The substrate 100 may be made of orinclude a semiconductor material, a ceramic material, one or more othersuitable materials, or a combination thereof. In some embodiments, thesubstrate 100 is a semiconductor wafer such as a silicon wafer. In someother embodiments, the substrate 100 is a glass wafer. In some otherembodiments, the substrate 100 is a polymer-containing substrate with aprofile similar to a silicon wafer.

As shown in FIG. 1A, multiple semiconductor die structures 20 aredisposed over the substrate 100, in accordance with some embodiments. Asshown in FIG. 2A, one of the semiconductor die structures 20 is bondedonto the substrate 100, in accordance with some embodiments. In someembodiments, each of the semiconductor die structures 20 includes astack of multiple semiconductor dies 202A-202G. The stack of multiplesemiconductor dies may include four to twelve (or more) semiconductordies. In some embodiments, the semiconductor dies 202A-202G are used toprovide the same or similar functions. In some embodiments, thesemiconductor dies 202A-202G are memory dies. In some embodiments, eachof the semiconductor die structures 20 further includes a semiconductordie 204. The semiconductor die 204 may be used to transmit electricalsignals into and/or from the stack of the semiconductor dies 202A-202G.

As shown in FIG. 2A, bonding structures 206 are formed between thesemiconductor dies 202A-202G and 204, in accordance with someembodiments. The semiconductor die structure 20 may also be bonded ontothe substrate 100 using some of the bonding structures 206, as shown inFIG. 2A. In some embodiments, the bonding structures 206 includeconductive pillars and solder elements.

In some embodiments, through substrate vias (TSVs) 208 are formed in thesemiconductor dies 202A-202G, as shown in FIG. 2A. The TSVs 208 may beused to form electrical connections between the stacked semiconductordies 202A-202G and 204. In some embodiments, other through substratevias (TSVs) 210 are formed in the substrate 100.

In some embodiments, the semiconductor dies 202A-202G are stackedtogether through the bonding structures 206 one by one at a firstposition of the substrate 100, as shown in FIG. 1A. Afterwards, othersemiconductor dies 202A-202G are stacked together through the bondingstructures 206 one by one again at a second position, as shown in FIG.1A. The stacking process is repeatedly carried out to bond thesemiconductor die structures 20 onto the substrate 100, as shown in FIG.1A.

In some embodiments, the semiconductor die structures 20 further includethe semiconductor dies 204. The stacking of the semiconductor dies 204may be carried out after all the other semiconductor dies 202A-202G ofdifferent semiconductor die structures 20 are stacked. In someembodiments, a thermal reflow process is performed to the solderelements of the bonding structures 206. As a result, the bondingstrength of the bonding structures 206 is enhanced.

As shown in FIG. 1B, a protective film 102 is provided and ready to belaminated onto the substrate 100, in accordance with some embodiments.In some embodiments, the protective film 102 is an insulating film. Theprotective film 102 may be made of or include an epoxy-based resin. Insome embodiments, the protective film 102 includes fillers that aredispersed in the epoxy-based resin. The fillers may include fibers (suchas silica fibers), particles (such as silica particles), or acombination thereof. In some embodiments, the lower surface of theprotective film 102 facing the substrate 100 is adhesive. Therefore, theprotective film 102 may be attached onto the substrate 100 like anadhesive tape in a subsequent lamination process.

As shown in FIG. 1B, multiple openings 104 are formed in the protectivefilm 102, in accordance with some embodiments. The openings 104 maycompletely penetrate through the protective film 102. Each of theopenings 104 has a size that is large enough to expose an entirety ofthe corresponding semiconductor die structure 20 if the protective film102 is laminated onto the substrate 100 later. In some embodiments, eachof the openings 104 has a profile similar to that of the semiconductordie structure 20.

The openings 104 may be formed using an energy beam drilling process, amechanical drilling process, a photolithography process, one or moreother applicable processes, or a combination thereof. For example, theenergy beam used in the energy beam drilling process includes a laserbeam, an electron beam, an ion beam, a plasma beam, one or more othersuitable beams, or a combination thereof.

As shown in FIGS. 1C and 2B, the protective film 102 is disposed ontothe substrate 100, in accordance with some embodiments. After theprotective film 102 is disposed, the openings 104 of the protective film102 expose the semiconductor die structures 20. In some embodiments,sidewalls of the openings 104 surround the semiconductor die structures20, as shown in FIGS. 1C and 2B. In some embodiments, the sidewalls ofthe openings 104 are substantially vertical sidewalls, as shown in FIG.2B.

Portions of the substrate 100 may also be exposed by the openings 104since the openings 104 are wider than the semiconductor die structures20, as shown in FIGS. 1C and 2B. One or more rollers may be used toassist in the attachment of the protective film 102.

FIG. 3 is a top view of an intermediate stage of a process for forming apackage structure, in accordance with some embodiments. In someembodiments, FIG. 3 is a top view of a portion of the structure shown inFIG. 2B. In some embodiments, sidewalls of the opening 104 continuouslysurround the semiconductor die structure 20.

As shown in FIGS. 2B and 3, the semiconductor die structure 20 isseparated from a first sidewall S₁ of the opening 104 by a firstdistance W₁. The semiconductor die structure 20 is separated from asecond sidewall S₂ of the opening 104 by a second distance W₂. The firstsidewall S₁ and the second sidewall S₂ may be opposite sidewalls of theopening 104, as shown in FIG. 2B. In some embodiments, the firstdistance W₁ is longer than the second distance W₂. The first distance W₁may be in a range from about 200 μm to about 400 μm. The second distanceW₂ may be in a range from about 50 μm to about 250 μm.

However, embodiments of the disclosure are not limited thereto. Manyvariations and/or modifications can be made to embodiments of thedisclosure. In some other embodiments, the first distance W₁ issubstantially equal to the second distance W₂.

As shown in FIG. 2C, an underfill material 108 is dispensed orintroduced into the opening 104, in accordance with some embodiments. Insome embodiments, the underfill material 108 is a polymer-containingliquid with flowability. The underfill material 108 is in a liquid statewhile being dispensed into the opening 104. In some embodiments,droplets of polymer-containing liquids 106 are dispensed into theopening 104 to provide a suitable amount of the underfill material 108.

The underfill material 108 may be made of or include an epoxy-basedresin. In some embodiments, the underfill material 108 includes fillersthat are dispersed in the epoxy-based resin. The fillers may includefibers (such as silica fibers), particles (such as silica particles), ora combination thereof.

As shown in FIG. 2C, the underfill material 108 is dispensed onto aposition that is closer to the first sidewall S₁ than the secondsidewall S₂ of the opening 104, in accordance with some embodiments. Asshown in FIG. 2C, the droplets of polymer-containing liquids 106 arecloser to the first sidewall S₁ than the second sidewall S₂ of theopening 104.

As mentioned above, in some embodiments, the first distance W₁ is longerthan the second distance W₂. The first distance W₁ may be in a rangefrom about 200 μm to about 400 μm. The second distance W₂ may be in arange from about 50 μm to about 250 μm. Because the first distance W₁ islonger than the second distance W₂, dispensing the underfill material108 onto the position that is closer to the first sidewall S₁ is easierthan dispensing the underfill material 108 onto the position closer tothe second sidewall S₂.

In some cases, if the first distance W₁ is smaller than about 200 μm, itmight be difficult to dispense the underfill material 108 (or thedroplets of polymer-containing liquids 106) into the opening 104 due tosmall spacing. In some other cases, if the first distance W₁ is longerthan about 400 μm, the underfill material 108 may occupy too large anarea of the substrate 100. The throughput may be negatively affected.

In some cases, if the second distance W₂ is smaller than about 50 μm,the semiconductor die structure 20 may be too close to the secondsidewall S₂. A high thermal stress might be generated during asubsequent thermal process since no sufficient amount of underfillmaterial is between the semiconductor die structure 20 and the secondsidewall S₂. In some other cases, if the second distance W₂ is longerthan about 250 μm, the underfill material 108 may occupy too large anarea of the substrate 100. The throughput may be negatively affected.

In some embodiments, a portion of the underfill material 108 flows intospace between the semiconductor dies 202A-202G and 204, as shown in FIG.2C. The underfill material 108 may be sucked into the space between thesemiconductor dies 202A-202G and 204 due to the capillary phenomenon. Insome embodiments, the underfill material 108 surrounds the bondingstructures 206 between the semiconductor dies 202A-202G and 204. In someembodiments, the underfill material 108 is in direct contact with thebonding structures 206.

As shown in FIGS. 1D and 2D, the underfill material 108 substantiallyfilling the openings 104 is then cured to form multiple underfillelements (or protective films or protective elements) 110 in theopenings 104, in accordance with some embodiments. Due to theconfinement of the protective film 102, the underfill elements 110 areformed at predetermined positions without occupying too much of the areaof the substrate 100. The throughput may therefore be improved. As shownin FIG. 1D, the protective film 102 surrounds the underfill elements 110and covering sidewall surfaces of the underfill elements 110, inaccordance with some embodiments. In some embodiments, the protectivefilm 102 encircles the underfill elements 110 and covering an entiretyof sidewall surfaces of the underfill elements 110.

A thermal curing process may be carried out to cure the underfillmaterial 108 to form the underfill elements 110, in accordance with someembodiments. The thermal curing process may be performed at atemperature that is in a range from about 100 degrees C. to about 250degrees C. for about 30 minutes to about 12 hours. After the thermalcuring process, the underfill material 108 may shrink and become theunderfill elements 110.

Similar to the underfill material 108, the underfill elements 110 have asimilar composition. The underfill elements 110 may be made of orinclude an epoxy-based resin. In some embodiments, the underfillmaterial 108 includes fillers that are dispersed in the epoxy-basedresin. The fillers may include fibers (such as silica fibers), particles(such as silica particles), or a combination thereof.

As mentioned above, in some embodiments, the protective film 102 is madeof or includes an epoxy-based resin with fillers dispersed therein. Thefillers may include fibers (such as silica fibers), particles (such assilica particles), or a combination thereof. In some embodiments, theprotective film 102 has a greater weight percentage of fillers than theweight percentage of fillers of the underfill elements 110. In someembodiments, the fillers in the protective film 102 have a greateraverage size than the fillers in the underfill elements 110.

Due to the confinement of the protective film 102, the underfillelements 110 are separated from each other. Each of the underfillelements 110 has a predetermined area. Therefore, the thermal stressgenerated from forming the underfill elements 110 is reduced. Thewarpage of the substrate 100 after the thermal curing process issignificantly reduced, which facilitates to subsequent packagingprocesses. A smaller amount of underfill material is used for formingthe underfill elements 110. The time and cost of the process may bereduced.

In some other cases where the protective film 102 is not formed toconfine the underfill material 108, a greater amount of underfillmaterial may be dispensed in order to reach a high enough level to coverthe bonding structures 206 between the semiconductor dies 204 and 202G.As a result, the underfill material may extend over the entire surfaceof the substrate 100. Underfill material that extends over a large areamay cause high thermal stress during the thermal curing process and leadto large degree of warpage of the substrate 100. The warpage of thesubstrate 100 may negatively affect the subsequent packaging processes.A greater amount of underfill material may also increase the cost ofprocess and of the subsequent cleaning process.

As shown in FIG. 2E, a planarization process is used to partially removethe protective film 102 and the underfill element 110, in accordancewith some embodiments. Therefore, the top surface of the structure shownin FIG. 2E or FIG. 1D may be substantially coplanar, which facilitatesto the subsequent packaging processes. In some embodiments, a portion ofthe semiconductor die 204 is also thinned during the planarizationprocess. The planarization process may include a grinding process, achemical mechanical polishing (CMP) process, a dry polishing process, anetching process, one or more other applicable processes, or acombination thereof.

In some embodiments, a dispenser 190 is used to dispense the underfillmaterial for forming the underfill element 110, as shown in FIG. 1D. Insome embodiments, the dispenser 190 is used to respectively dispense thepolymer-containing liquid 106 into the openings 104 (as shown in FIG.1C) one by one.

However, embodiments of the disclosure are not limited thereto. Manyvariations and/or modifications can be made to embodiments of thedisclosure. In some other embodiments, two or more dispensers are usedfor dispensing the underfill material.

FIG. 4 is a perspective view of an intermediate stage of a process forforming a package structure, in accordance with some embodiments. Asshown in FIG. 4, two dispensers 190 and 190′ are used to dispensepolymer-containing liquids 106 and 106′ into the openings 104 (as shownin FIG. 1C). In some embodiments, the dispensers 190 and 190′ are usedto respectively dispense the polymer-containing liquids 106 and 106′into the openings 104 (as shown in FIG. 1C) one by one. In someembodiments, the dispensers 190 and 190′ are not used to dispense thepolymer-containing liquid into the same opening 104 at the same time. Insome embodiments, the dispensers 190 and 190′ are used to dispense thepolymer-containing liquid into different openings 104, respectively.

In some embodiments, because the dispensers 190 and 190′ do not dispensethe polymer-containing liquid into the same opening 104, the flowdirection of the polymer-containing liquid may be controlled in asuitable direction. Voids may be prevented from being formed in thespace between the semiconductor dies 202A-202G and 204. In some othercases, if two dispensers are used to dispense the polymer-containingliquids into the same opening, the polymer-containing liquids may flowinto the space between the semiconductor dies 202A-202G and 204 fromdifferent positions. As a result, a middle portion of the space may notbe able to be filled with the polymer-containing liquids, which may leadto the formation of voids. The voids may negatively affect thereliability and performance of the package structure.

In some embodiments illustrated in FIGS. 1B-1D, each of the openings 104of the protective film 102 has a rectangular top view profile. However,embodiments of the disclosure are not limited thereto. Many variationsand/or modifications can be made to embodiments of the disclosure. Insome other embodiments, the openings 104 have top view profiles otherthan rectangular profiles.

FIGS. 5A-5C are perspective views of various stages of a process forforming a package structure, in accordance with some embodiments. Asshown in FIG. 5A, similar to the embodiments illustrated in FIG. 1B, theprotective film 102 is provided and ready to be laminated onto thesubstrate 100, in accordance with some embodiments. As shown in FIG. 5A,multiple openings 104′ are formed in the protective film 102, inaccordance with some embodiments. The openings 104′ may completelypenetrate through the protective film 102. Each of the openings 104′ hasa size that is large enough to expose an entirety of the correspondingsemiconductor die structure 20 if the protective film 102 is laminatedonto the substrate 100 later. In some embodiments, each of the openings104′ has a circular or oval profile.

The openings 104′ with the circular or oval profile may be formed usingan energy beam drilling process, a mechanical drilling process, aphotolithography process, one or more other applicable processes, or acombination thereof. For example, the energy beam used in the energybeam drilling process includes a laser beam, an electron beam, an ionbeam, a plasma beam, one or more other suitable beams, or a combinationthereof.

As shown in FIGS. 5B, the protective film 102 is disposed onto thesubstrate 100, in accordance with some embodiments. After the protectivefilm 102 is disposed, the openings 104′ of the protective film 102expose the semiconductor die structures 20. In some embodiments,sidewalls of the openings 104′ encircle the semiconductor die structures20, as shown in FIG. 5B.

Portions of the substrate 100 may also be exposed by the openings 104′since the openings 104′ are wider than the semiconductor die structures20, as shown in FIG. 5B. One or more rollers may be used to assist inthe attachment of the protective film 102.

As shown in FIG. 5C, similar to the embodiments illustrated in FIG. 1Dor 4, one or more dispensers 190 are used to dispense thepolymer-containing liquids into the openings 104′. In some embodiments,a thermal curing process is then used to cure the polymer-containingliquids into underfill elements 110. Due to the rounded profiles of theunderfill elements 110, the stress may be reduced.

In some embodiments, the openings 104 or 104′ of the protective film 102have substantially vertical sidewalls. However, embodiments of thedisclosure are not limited thereto. Many variations and/or modificationscan be made to embodiments of the disclosure.

FIG. 6 is a cross-sectional view of a package structure, in accordancewith some embodiments. In some embodiments, the protective film 102 hasirregular sidewalls other than vertical sidewalls, as shown in FIG. 6.As shown in FIG. 6, the protective film 102 has a first sidewall S₁′ anda second sidewall S₂′. Different from the first sidewall S₁ and thesecond sidewall S₂ shown in FIG. 2E, the first sidewall S₁′ and thesecond sidewall S₂′ have irregular or non-planar profiles.

As shown in FIG. 6, the top of the semiconductor die structure 20 islaterally separated from the top of the first sidewall S₁′ of theprotective film 102 by a first distance W₁′. The top of thesemiconductor die structure 20 is separated from the top of the secondsidewall S₂′ of the protective film 102 by a second distance W₂′. Thefirst sidewall S₁′ and the second sidewall S₂′ may be opposite sidewallsof the protective film 102. In some embodiments, the first distance W₁′is longer than the second distance W₂′. The first distance W₁′ may be ina range from about 200 μm to about 400 μm. The second distance W₂ may bein a range from about 50 μm to about 250 μm.

In some embodiments, the polymer-containing liquid used for forming theunderfill element 110 is dispensed at a position that is closer to thefirst sidewall S₁′ than the second sidewall S₂′. Because the firstsidewall S₁′ is separated from the semiconductor die structure 20 by alonger distance, the dispensing of the polymer-containing liquid wouldbe easier. The quality and reliability of the underfill element 110 areimproved.

In some embodiments, each of the semiconductor die structures 20includes a stack of multiple semiconductor dies. However, embodiments ofthe disclosure are not limited thereto. Many variations and/ormodifications can be made to embodiments of the disclosure. In someother embodiments, some or all of the semiconductor die structures 20are not a stack of multiple semiconductor dies. Each of thesemiconductor die structures 20 may include only one semiconductor die.

Embodiments of the disclosure form a package structure by attachingprotective element with openings onto a substrate. Each of the openingssurrounds or encircles a semiconductor die structure. An underfillmaterial liquid is dispensed into the opening and is then cured to forman underfill element surrounding and protecting bonding structures ofthe semiconductor die structure. Due to the confinement of theprotective film, the underfill element is formed at predeterminedpositions without occupying too much of the area. The cost and time ofthe process may be reduced. Warpage of the substrate caused by thecuring process for forming the underfill element may also besignificantly reduced since the underfill material liquid merelyoccupied a confined area. The performance and reliability of the packagestructure are improved.

In accordance with some embodiments, a method for forming a packagestructure is provided. The method includes disposing a semiconductor diestructure over a substrate. The method also includes disposing aprotective film over the substrate. The protective film has an openingexposing the semiconductor die structure, and sidewalls of the openingsurround the semiconductor die structure. The method further includesdispensing an underfill material into the opening to surround thesemiconductor die structure.

In accordance with some embodiments, a method for forming a packagestructure is provided. The method includes disposing a firstsemiconductor die structure and a second semiconductor die structureover a substrate. The method also includes disposing a protective filmover the substrate. The protective film has two openings respectivelyexposing the first semiconductor die structure and the secondsemiconductor die structure. Sidewalls of the openings respectivelysurround the first semiconductor die structure and the secondsemiconductor die structure. The method further includes respectivelydispensing a polymer-containing liquid into the openings to surround thefirst semiconductor die structure and the second semiconductor diestructure. In addition, the method includes curing thepolymer-containing liquid to form a first protective element and asecond protective element respectively surrounding the firstsemiconductor die structure and the second semiconductor die structure.

In accordance with some embodiments, a package structure is provided.The package structure includes a substrate and a semiconductor diestructure over the substrate. The package structure also includes anunderfill element surrounding the semiconductor die structure. Thepackage structure further includes a protective film surrounding theunderfill element and covering sidewall surfaces of the underfillelement.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for forming a package structure,comprising: disposing a semiconductor die structure over a substrate;disposing a protective film over the substrate, wherein the protectivefilm has an opening exposing the semiconductor die structure, andsidewalls of the opening surround the semiconductor die structure; anddispensing an underfill material into the opening to surround thesemiconductor die structure.
 2. The method for forming a packagestructure as claimed in claim 1, wherein the semiconductor die structurecomprises a stack of multiple semiconductor dies.
 3. The method forforming a package structure as claimed in claim 2, wherein a portion ofthe underfill material flows into a space between the multiplesemiconductor dies to surround bonding structures between the multiplesemiconductor dies.
 4. The method for forming a package structure asclaimed in claim 1, further comprising curing the underfill material toform an underfill element surrounding the semiconductor die structure.5. The method for forming a package structure as claimed in claim 4,wherein the protective film comprises first fillers, the underfillelement comprises second fillers, and the protective film has a greaterweight percentage of the first fillers than a weight percentage of thesecond fillers of the underfill element.
 6. The method for forming apackage structure as claimed in claim 5, wherein the first fillers havea greater average size than that of the second fillers.
 7. The methodfor forming a package structure as claimed in claim 1, wherein thesemiconductor die structure is separated from a first sidewall of theopening by a first distance and separated from a second sidewall of theopening by a second distance.
 8. The method for forming a packagestructure as claimed in claim 7, wherein the first distance is longerthan the second distance, and the underfill material is dispensed onto aposition that is closer to the first sidewall than the second sidewall.9. The method for forming a package structure as claimed in claim 1,wherein the underfill material is in a liquid state while beingdispensed into the opening.
 10. The method for forming a packagestructure as claimed in claim 1, further comprising partially removingthe protective film and the underfill material using a planarizingprocess.
 11. A method for forming a package structure, comprising:disposing a first semiconductor die structure and a second semiconductordie structure over a substrate; disposing a protective film over thesubstrate, wherein the protective film has two openings respectivelyexposing the first semiconductor die structure and the secondsemiconductor die structure, and sidewalls of the openings respectivelysurround the first semiconductor die structure and the secondsemiconductor die structure; respectively dispensing apolymer-containing liquid into the openings to surround the firstsemiconductor die structure and the second semiconductor die structure;and curing the polymer-containing liquid to form a first protectiveelement and a second protective element respectively surrounding thefirst semiconductor die structure and the second semiconductor diestructure.
 12. The method for forming a package structure as claimed inclaim 11, wherein a dispenser is used to respectively dispense thepolymer-containing liquid into the openings one by one.
 13. The methodfor forming a package structure as claimed in claim 11, wherein a firstdispenser and a second dispenser are used to respectively dispense thepolymer-containing liquid into the openings.
 14. The method for forminga package structure as claimed in claim 13, wherein the first dispenserand the second dispenser are not used to dispense the polymer-containingliquid into a same opening of the openings at the same time.
 15. Themethod for forming a package structure as claimed in claim 11, whereinthe first semiconductor die structure is separated from a first sidewallof the openings by a first distance and separated from a second sidewallof the openings by a second distance, the first distance is longer thanthe second distance, and the polymer-containing liquid is dispensed ontoa position that is closer to the first sidewall than the secondsidewall.
 16. A package structure, comprising: a substrate; asemiconductor die structure over the substrate; an underfill elementsurrounding the semiconductor die structure; and a protective filmsurrounding the underfill element and covering sidewall surfaces of theunderfill element.
 17. The package structure as claimed in claim 16,wherein the semiconductor die structure comprises a stack of multiplesemiconductor dies.
 18. The method for forming a package structure asclaimed in claim 17, wherein a portion of the underfill element extendsinto a space between the multiple semiconductor dies to surround bondingstructures between the multiple semiconductor dies.
 19. The packagestructure as claimed in claim 16, wherein the protective film comprisesfirst fillers, the underfill element comprises second fillers, and theprotective film has a greater weight percentage of the first fillersthan a weight percentage of the second fillers of the underfill element.20. The method for forming a package structure as claimed in claim 16,wherein the protective film comprises first fillers, the underfillelement comprises second fillers, and the first fillers have a greateraverage size than that of the second fillers.